Intel Corporation, Samsung Electronics and TSMC said they have reached an agreement on the need for industry-wide collaboration to make a transition to larger, 450mm-sized wafers starting in 2012. Basically, its something that happens about every ten years, started with the first wafers in 1991, increased to 300mm wafers in 2001, and they figure 2012 is the right time for the 450mm adoption. The increase in wafer size will reduce the overall cost and reduce the total amount of resources used per chip. Intel, Samsung Electronics, TSMC Reach Agreement for 450mm Wafer Manufacturing Transition
